Quick Overview: A full range of various dry storage cabinets ensures that your production is based on the IPC/JEDEC Standard STD-033B for moisture sensitive devices. To get more informations form below link: http://www.1clicksmt.com/products/desic
Quick Overview: A full range of various dry storage cabinets ensures that your production is based on the IPC/JEDEC Standard STD-033B for moisture sensitive devices. To get more informations form below link: http://www.1clicksmt.com/products/desic
Technical Library | 2021-01-28 01:55:00.0
Printed circuit board surface finishes are a topic of constant discussion as environmental influences, such as the Restriction of Hazardous Substances (RoHS) Directive or technology challenges, such as flip chip and 01005 passive components, initiate technology changes. These factors drive the need for greater control of processing characteristics like coplanarity and solderability, which influence the selection of surface finishes and impact costs as well as process robustness and integrity. The ideal printed circuit board finish would have good solderability, long shelf life, ease of fabrication/processing, robust environmental performance and provide dual soldering/wirebonding capabilities; unfortunately no single industry surface finish possesses all of these traits. The selection of a printed circuit board surface finish is ultimately a series of compromises for a given application.
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Industry Directory | Consultant / Service Provider
G2 provides a complete, integrated, cloud-based solution that increases manufacturers' visibility, control and recovery of revenue.
Industry Directory | Manufacturer
LGInternational develops advanced labeling solutions for semiconductor, storage media, life sciences, & electronics applications. LGI�s products are used for product identification and decoration, product assembly, product packaging and security.
Anti-skid cut-off finger cots(powder free) Description: Raw materials: 100% pure natural latex;Without plasticizers,silicone oil and amide. Powder-free;Chlorinated-yellow Transparent, Anti-static treated,Textured tip ,Rimless, Unrolled,Class 10 cl
100% (Test method GB-T7753-87) Storage Details Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging. Shelf life is 6 months from the date of
All electronic hardware is susceptible to the damaging effects of moisture, temperature, and contaminants. STI understands the criticality of reliability testing and test-to-failure. Improper selection of assembly materials and manufacturing processe
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