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Krayden to Showcase World-Class Product Lines at the AAT Expo

Industry News | 2012-06-01 12:42:29.0

Krayden, Inc. (krayden.com) will distribute its suppliers’ technologies in Booth #1049 at the upcoming Assembly & Automation Technology Expo,

Krayden Inc.

Don't Miss KYZEN’s QFN Design Considerations to Improve Cleaning during SMTAI

Industry News | 2014-09-19 20:19:38.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.

KYZEN Corporation

JBC is sponsoring the IPC Hand Soldering Competition at the SMT show

Industry News | 2016-04-22 02:21:20.0

JBC is a Gold Sponsor of the IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2016, which will be held in Nuremberg (Germany) on April 26-28.

JBC Soldering Tools

Techcon Systems to Exhibit at Bondexpo, Oct. 10-13, in Stuttgart, Germany

Industry News | 2016-09-21 15:24:34.0

Techcon Systems today announced plans to exhibit in hall 9, booth 9606 at the Bondexpo, scheduled to take place Oct. 10-13, 2016 in Stuttgart, Germany. The company will showcase its new Custom Filling Service at the show.

Techcon Systems

Yokogawa DCS  CS1000 CS3000

Yokogawa DCS CS1000 CS3000

New Equipment | Industrial Automation

Yokogawa DCS  CS1000 CS3000 : AAI141 AAV141 AAV142 AAI841 AAB841 AAV542 AAI143 AAI543 AAV144 AAV544 AAT141 AAR181 AAI135 AAI835 AAT145 AAR145 AAP135 AAP149 AAP849   ADV151 ADV551 ADV141 ADV142 ADV157 ADV557 ADV161 ADV561 ADR541 CENTUM:ADV85

zhengzhou yuzhe electronic technology co.,ltd

Brand new and original

Brand new and original

Videos

Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us   ✭Product  Overview✭ Brand:YOKOGAWA Part Number:AAT141-S00 Description:IO MODULE Condition:Brand new and original in s

MOORE Automation Ltd.

Christopher Associates/Koki Solder to Present Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Applications at SMTAI 2010

Industry News | 2010-09-27 23:01:06.0

Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

Virtual Industries Announces Show Special for AAT Expo

Industry News | 2012-06-05 14:18:47.0

Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, will highlight the Small Part Handling Kit in Booth #1047 at the upcoming Assembly & Automation Technology Expo, scheduled to take place June 19-21, 2012 at McCormick Place North in Chicago, IL.

Virtual Industries, Inc.

Indium Corporation Technology Experts to Lead Technical Sessions at SMTAi 2014.

Industry News | 2014-07-29 12:33:11.0

Several Indium Corporation technology experts will lead technical sessions at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.

Indium Corporation

Nordson DIMA introduces new inline concept for hot bar bonding and soldering at Productronica 2017

Industry News | 2017-11-08 15:24:31.0

Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.

C-Tech Systems, B.V. [formerly Nordson DIMA]


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