Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Tue Aug 30 09:24:08 EDT 2005 | Slaine
we manufacture a range of ceramic parts that have silver termination,there is already a small leaching problem (absorption of the termination by the solder in liquid form)with Sn62 that we live with, having to implement unleaded solder they are norma
Industry News | 2012-11-13 09:35:09.0
Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.
Industry News | 2010-04-19 12:56:32.0
BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2008-02-05 22:48:55.0
This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb elements to the SnAgCu solders. The influence of added elements on the electrical and mechanical properties of solder joints created by these solders between PCB and electronic components were evaluated.
Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences
ALPHA® Preforms with solder paste adds solder volume.
ST New and Origina STB140NF75T4 in Stock IC TO-263, 2022+ package STB140NF75T4 N-CHANNEL 75V - 0.0065OHM -120A D2PAK STripFET II MOSFET Today's Hot Deals： MK64FN1M0VLQ12 LQFP144 FAIRCHILD 20+ SPBTLE-1STR MODULE STM 19+ UJA1169ATK/F/3 HVSON20
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
SMTnet Express, March 10, 2016, Subscribers: 24,118, Companies: 14,735, Users: 39,803 Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel, Aileen Allen, Elizabeth Elias Benedetto, Rahul Joshi; HP Inc. Since the implementation
| https://www.wesource.com/test-and-measurement-equipment/amrel-pd-20-7.5de-programmable-dc-power-supply-id-001842-10/22/
Cleaners Pumps and Motors Reflow Ovens Rework Systems and Accessories Screen Printers Selective Soldering Machines Solder Paste and PCB Inspection Machines Spare Parts DEK Juki MyData Philips/Assembleon
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/3-things-you-should-know-about-lead-free-soldering/
3 Things You Should Know About Lead-Free Soldering - Blackfox - Premier Training and Certification Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | Search for: Course Calendar Course Calendar 2023 IPC Certification Online
