Full Site - : peak (Page 12 of 1131)

Intermetallic Growth in Tin-Rich Solders

Technical Library | 2017-06-13 17:14:59.0

For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-

General Electric

Durable Conductive Inks and SMD Attachment for Robust Printed Electronics

Technical Library | 2018-10-24 18:04:12.0

Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many applications once thought beyond the capability of PTF circuitry. This paper describes peak performance and areas for future improvement.State-of-the-art PTF circuitry performance includes the ability to withstand sharp crease tests, 85C/85%RH damp heat 5VDC bias aging (silver migration), auto seat durability cycling, SMT mandrel flexing, and others. The IPC/SGIA subcommittee for Standards Tests development has adopted several ASTM test methods for PTF circuitry and is actively developing needed improvements or additions. These standards are described herein. Advantages of PTF circuitry over copper include: varied conductive material compositions, lower cost and lower environmental impact. Necessary improvements include: robust integration of chip and power, higher conductivity, and fine line multi-layer patterning.

Engineered Materials Systems, Inc.

A Study On Process, Strength And Microstructure Analysis Of Low Temperature SnBi Containing Solder Pastes Mixed With Lead-Free Solder Balls

Technical Library | 2021-08-25 16:34:37.0

As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.

Rochester Institute of Technology

New Webinar: InoAuto Mobile Sneak Peak!

Industry News | 2022-02-25 14:07:45.0

Inovaxe is excited to announce that it will offer a sneak peak of its new InoAuto Mobile. The 30-minute webinar is scheduled to take place Monday, Feb. 28, 2022 at 11 a.m. PT | 2 p.m. ET | 19:00 GMT.

Inovaxe Corporation

Brand new and original

Brand new and original

Videos

Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us   ✭Product  Overview✭ Manufacturer Rockwell Automation Brand Allen-Bradley Manufacture

MOORE Automation Ltd.

Anritsu Used MS9740A Anritsu Spectrum Analyzer--Mega Tech sz

Anritsu Used MS9740A Anritsu Spectrum Analyzer--Mega Tech sz

Used SMT Equipment | General Purpose Test & Measurement

Main features Reduces total analysis time by measuring passive optics at <0.2s (5nm) Dedicated applications for evaluating active optics Excellent price/performance ratio Dynamic range performance 60 dB (0.4 nm from peak wavelength) 30 pm minimum r

Shenzhen Megatech

Agilent N1076A Keysight Electric Clock Recovery

Agilent N1076A Keysight Electric Clock Recovery

Used SMT Equipment | General Purpose Test & Measurement

N1076A  Main  features 50 MBaud to 32 GBaud data rate range  (continuous) on electrical NRZ and PAM-4 digital signals Provides  standards-compliant clock recovery ("optimal phase-locked loop"),  including adjustable loop bandwidth (up to 20 MHz) and

Shenzhen Megatech

Agilent E4405B-1D5-1DN-1DS-1DR-A4H-B72-BAC

Agilent E4405B-1D5-1DN-1DS-1DR-A4H-B72-BAC

Used SMT Equipment | In-Circuit Testers

Agilent E4405B-1D5-1DN-1DS-1DR-A4H-B72-BAC Spectrum Analyzer, 9 kHz to 13.2 GHz Agilent-Hp E4405B-COM ESA-E Communication Spectrum Analyzer, 9 kHz to 13.2 GHz The Agilent E4405B spectrum analyzer operates between the 9 kHz to 13.2 GHz frequen

Test Equipment Connection

Vitronics Quants pro 6738Q2

Vitronics Quants pro 6738Q2

Used SMT Equipment | Soldering - Reflow

Reflow oven Vitronics Soltec Quants pro 6738Q2 built: 2000, with 6 heating zones top, 2 peak heating zones above and below, 2 cooling zones under, length processing zone 4180 mm, heating zone 3350 mm, control computer with LCD monitor, chain pint con

H.O. Lamberink

Agilent E4405B

Agilent E4405B

Used SMT Equipment | In-Circuit Testers

Agilent-Keysight E4405B Agilent-Hp E4405B-COM ESA-E Communication Spectrum Analyzer, 9 kHz to 13.2 GHz The Agilent E4405B spectrum analyzer operates between the 9 kHz to 13.2 GHz frequency range, offers +/- 1 dB amplitude accuracy, 40 updates /

Test Equipment Connection


peak searches for Companies, Equipment, Machines, Suppliers & Information