100% full New - Original Factory Seal Warranty: 12 months Package: Original packing with cartons. Payment Term: 100% T/T In Advance Service: Worldwide BENTLY NEVADA 3500/60 Jim.Sales Manager Mobile: 86-18020776782 (WhatsApp) Email: sales
100% full New - Original Factory Seal Warranty: 12 months Package: Original packing with cartons. Payment Term: 100% T/T In Advance Service: Worldwide BENTLY NEVADA 3500/61 Jim.Sales Manager Mobile: 86-18020776782 (WhatsApp) Email: sales
100% full New - Original Factory Seal Warranty: 12 months Package: Original packing with cartons. Payment Term: 100% T/T In Advance Service: Worldwide BENTLY NEVADA 3500/65 Jim.Sales Manager Mobile: 86-18020776782 (WhatsApp) Email: sales
100% full New - Original Factory Seal Warranty: 12 months Package: Original packing with cartons. Payment Term: 100% T/T In Advance Service: Worldwide BENTLY NEVADA 3500/60 and 3500/61 Jim.Sales Manager Mobile: 86-18020776782 (WhatsApp)
Industry Directory | Manufacturer
Datapaq, founded in 1984, is the world leader in temperature profiling. Datapaq systems provide key information on the effectiveness of heat processing in the electronics assembly industry, using the most advanced and tested techniques.
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Used SMT Equipment | Soldering - Reflow
7 top-side preheating zones, 3 top and bottom-side peak zones Cooling step 1, basic cooling from the top and bottom side Working width of 720mm Adjustable fan speed (cooling and peak zone) Temperature monitoring of the cooling zone Top and bottom-sid
