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Indium Corporation Introduces Liquid Flip-Chip Flux

Industry News | 2022-03-09 12:32:53.0

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.

Indium Corporation

SHENMAO Offers Low-Temperature Lead-Free Solder Paste PF735-PQ10-10L for High-Speed Printing

Industry News | 2023-02-27 18:10:50.0

SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.

Shenmao Technology Inc.

Nihon Superior to Introduce TempSave duringAPEX 2021

Industry News | 2021-02-12 16:08:40.0

Nihon Superior Co. Ltd is pleased to announce thatit will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloyalong with SN100CV P608 and LF-C2 P608 solder pastes.

Seika Machinery, Inc.

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2021-10-07 15:29:25.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-01-03 07:24:21.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2022-10-06 18:19:54.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1230 at the SMTA International Exposition, scheduled to take place Nov. 2-3, 2022 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-12-21 10:42:04.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight SN100CV P608 Paste at SMTAI

Industry News | 2023-09-11 17:19:08.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.

Nihon Superior Co., Ltd.

KIC Debuts SunKIC � The First Profiler Specifically Designed for Solar Cell Manufacturing

Industry News | 2008-08-14 12:45:57.0

San Diego � August 12, 2008 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces the release of a thermal profiler that is specifically designed for the unique needs and challenges of the PV industry. The SunKIC benefits from several hardware and software innovations that help solar cell manufacturers better manage their thermal processes and hence increase their solar cell efficiency.

KIC Thermal


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