Industry News | 2008-10-07 20:52:28.0
OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
Industry News | 2007-10-30 00:50:36.0
At the Productronica 2007 tradeshow in Munich, FINETECH, long-time specialist in rework and micro assembly, will present three brand new product solutions.
Industry News | 2007-11-27 12:21:58.0
At the Productronica 2007 tradeshow in Munich, FINETECH, long-time specialist in rework and micro assembly, will present three brand new product solutions.
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2020-04-30 12:05:37.0
Seika Machinery, Inc. is pleased to offer the new PCU-285 Spiral Viscometer and DS-10S Dip Tester for Selective Solder from Malcom.
Industry News | 2019-10-08 06:12:57.0
SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.
Industry News | 2019-11-25 11:02:32.0
SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.
Industry News | 2023-03-27 13:09:49.0
Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.
Industry News | 2019-08-12 20:00:01.0
SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”
With the new EXOS 10/26, Ersa GmbH presents a vacuum reflow soldering system with which the void rate can be reduced by 99%. More about the EXOS 10/26 ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/reflow-soldering/pr
