Industry Directory | Manufacturer
Datapaq, founded in 1984, is the world leader in temperature profiling. Datapaq systems provide key information on the effectiveness of heat processing in the electronics assembly industry, using the most advanced and tested techniques.
Industry Directory | Manufacturer
Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.
10 Zones Economical SMT Reflow Oven KTE-1000 Heating:10 heating zones Cooling zones: top 2 Weigth: APPROX 2615KG Dimension: 6135*1360*1490mm Product description: 10 Zones Economical SMT Reflow Oven KTE-1000, Heating:10 heating zones, Cooling z
Thermal infrared (IR) imaging analysis aids dramatically in characterizing an electronics assembly’s thermal dissipation and identifying peak junction temperatures of the populated component set. The results from IR Thermography testing can influence
Electronics Forum | Thu Aug 11 12:45:42 EDT 2016 | anhsang38
Dear All I have a question for the reflow machine. I'm using Vitronics(Mr933+)reflow. The peak temperature of the (Chip, LED, SOT) component higher than (QFP,LGA) about 4 degree when i measured proflie. All of them on the same board . I don't know w
Electronics Forum | Fri Aug 12 08:52:29 EDT 2016 | sarason
In short physics. A large Black object will absorb more energy than a smaller non-black object. Thus the temperature will remain lower around the black object as it heats up ! sarason
Used SMT Equipment | Soldering - Reflow
REHM VXS Nitro 4550 (Type 945) Oven Serial Nr.: 3439 Year of Manufacture: 2013 Direction: Left to Right Transfer height: 900mm (+/- 75mm) Process Chamber Heating: Length: 4550mm Qty of preheating zones: 9 Length of preheating zone: 3150mm Qty of pea
Used SMT Equipment | Soldering - Reflow
7 top-side preheating zones, 3 top and bottom-side peak zones Cooling step 1, basic cooling from the top and bottom side Working width of 720mm Adjustable fan speed (cooling and peak zone) Temperature monitoring of the cooling zone Top and bottom-sid
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support
WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1148-heat-damage
. For lead-free solders the peak temperature could be as high as 260o C. Result Imaging in both instances was performed at 30 MHz. In this component there are no delaminations along the lead fingers
