Full Site - : peel force (Page 8 of 10)

Re: V-Tek Tape and Reel Machines...

Electronics Forum | Fri Apr 23 17:44:50 EDT 1999 | Stefan Witte

| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c

Re: Passive component shear Testing

Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F

Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for

Re: Component Baking

Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory

Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Fuji CP-6 Feeder Maintenance Programs

Electronics Forum | Fri Nov 09 07:28:48 EST 2007 | jola

We have tested the Feeder Master and I have to say, we are not impressed at all. The main thing that we thought would be great with it was to test the feeders in full speed, but you dont get any data out from the machine so you only end up waching th

Philips/Assembleon GEM Feeders 'Sugglish'

Electronics Forum | Wed Jul 02 16:58:40 EDT 2008 | jmelson

If these are similar to the earlier CSM feeders, there are several things to check. The cover plate that holds the tape on the sprocket can be adjusted slightly by eccentrics to accomodate thicker tapes. It the cover is too tight, there will be bin

Wave soldering profiling

Electronics Forum | Wed May 12 12:11:54 EDT 2004 | solderpro

Bruce, regards to all who are trying to help and have great input, with those type of lead length, I would be very impressed to see you get rid of the problem, and as the others said, no clean in a foam fluxer, not good but workable.... the real issu

Re: Drying ICs any advice

Electronics Forum | Sun May 17 13:46:30 EDT 1998 | Steve Gregory

Hi All! I've been reading this conversation which prompted me to break out the IPC-SM-786A from the IPC manuals from our parent company in Maryland sent us (we're just starting up in California). It's the Procedures for Characterizing and Handling of

Via holes and Wave Solder

Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy

Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th

solder fillet peeling update....

Electronics Forum | Tue Jul 15 10:44:49 EDT 2003 | MA/NY DDave

Hi, Although I grit my teeth it does sound like a normal process engineer or engineering situation. Here you are with knowledge and ways to get knowledge of best practices and No One listens. ----- Now I have a cleanliness testing joke (real sto


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