Industry Directory | Manufacturer / Distributor
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
Industry Directory | Manufacturer
a pcb manufacturer in China specializing in multi-layer pcbs that meet RoHs, UL, IPC standards.
New Equipment | Fabrication Services
XPCB Limited is one of the leading flexible PCB suppliers in China. We fabricate and assemble the most complex flexible circuit boards for harsh applications, including Oil&Gas, Medical, Security, and Aircraft & Satellite. Layer supported: 1-12 laye
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Tue Jan 26 19:43:02 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Tue Jan 26 19:43:26 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Used SMT Equipment | Soldering - Wave
Speedline Technologies Electrovert EPK Gold Wave Solder Machine - just removered from production in working conditon. Currently in production and available now. 11/2005 DOM, 208VAC 3 Phase Power, Reciprocating Spray Fluxer, L to R Board Flow, Heavy D
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2013-09-25 16:06:25.0
On September 23, 2013, the National Development and Reform Commission (NDRC) of China issued a circular postponing the implementation of the regulation that would have eliminated cyanide-gold plating at the end of 2014.
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.
Parts & Supplies | Tape and Reel
High Temperature Masking dots High temperature masking tape and dots are ideal for masking gold fingers of printed circuit boards during wave solder or solder dip process, as well as for solder wave masking and electrical insulation. The p
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
we have many universal gold plus feeders to sell . www.smt-store.com
Events Calendar | Wed Sep 11 00:00:00 EDT 2024 - Wed Sep 11 00:00:00 EDT 2024 | San Diego, California USA
San Diego Chapter In-Person Event: Reclaiming Precious Metal from SMT Scrap
Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,
Wine Down Wednesday: Driving Innovation through Intrapreneurship
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
Career Center | Raleigh, North Carolina USA | Engineering
Title: SMT PROCESS ENGINEER Salary: 70k-80k max rate with great benefits Job Description: ESSENTIAL DUTIES & RESPONSIBILITIES To perform this job successfully, an individual must be able to perform each essential duty satisfactorily, plus w
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today�s Wave Solder systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/peel-testing?con=t&page=9
. Here are a few of our latest papers. SMD Shear Nordson DAGE Surface-mount devices (SMDs) are electrical components that are soldered to printed circuit boards (PCB
| http://etasmt.com/cc?ID=te_news_news,26368&url=comment
? From material talk Introduction to SMT Stencils for Printed Circuit Boards Metal Core Printed Circuit Boards Contact Us Reflow Oven, Reflow Soldering Oven Name: Shanny Email: info@smt11.com / etasmt@foxmail.com Skype
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
114 Barrington Town Square
Aurora, OH USA
Phone: 13309956900
