Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef
You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the
Electronics Forum | Wed Apr 19 16:43:05 EDT 2006 | samir
Silicone-based coatings "repel" most foreign,non-compatible materials like peelable solder mask, and rubber or vinyl boots. The result is, uncured material around the vicinity of where the boot was. Trust me. Been there and done that. As a rookie
Electronics Forum | Thu Aug 19 04:49:09 EDT 1999 | Earl Moon
| | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale
Electronics Forum | Thu Jun 04 20:52:57 EDT 1998 | D.Lange
| | I have gold fingers that I want to mask when running over the wave without pallets. They're on the leading edge of the board. I recall seeing rubber boots that slid onto the fingers to mask them. Pop 'em on before the wave; pop' em off after a
Electronics Forum | Sun Dec 31 07:31:40 EST 2006 | davef
Thoughts are: * Eliminate solder spotting on gold fingers through process improvement in broard handling, printing paste control, and reflow recipe development. Search the fine SMTnet Archives for previous discussions. * Dispense or print a reflow te
Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
Electronics Forum | Tue Jan 24 07:43:45 EST 2006 | Chunks
Q: If you do not use a selective wave pallet does this not leave the possibility of solder flowing up thru the Via's on the board? A: No. Your board house can cover your vias with solder resist. Your board house can plug the vias. You can cover t
Electronics Forum | Fri Jun 10 12:48:55 EDT 2016 | deanm
Kyle,thank you for steering me back on track. For relays and connectors I like Tom's suggestion provided you are allowed to add materials to your assemblies. An instant adhesive or perhaps a chip bonder (used in SMT) may work if the preheat is high e
Electronics Forum | Wed Nov 20 03:52:16 EST 2002 | iman
Hello, need help on intrusive reflow process, thanks in advance to the experts and general info sharing :) need some help to obtain answers, to following questions: 1) PCB is FR4, 1.6mm thick, 4 layers, what stencil thickness (stencil design guide
Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
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