Industry Directory | Manufacturer
Designers and Builders of PCB process PALLET solutions. Selective solder pallets. Surface Mount process carriers. Conformal Coating masking and spray clear pallets. Masking pallets for wave solder. Wash Trays with PCB securing
Industry News | 2017-01-24 17:10:51.0
At next month’s IPC APEX Expo (APEX) event in San Diego, California, Henkel Adhesive Technologies’ electronics business will display a full range of state-of-the-art electronic materials, all designed to push the conventional limits of performance capability. From February 14 through 16 in booth #1501, Henkel’s line of game-changing solder, encapsulant, underfill and thermal materials will be on show.
New Equipment | Rework & Repair Equipment
MLT provides laser services for selective solder mask removal as a precise and controlled rework option. No more scrapping or tedius hours to rework selective areas to recover simply unwanted solder mask. This same process works from many other mat
Parts & Supplies | Circuit Board Assembly Products
1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting holes
Parts & Supplies | Circuit Board Assembly Products
1). 80*50mm/1up, Bergquist Thermal Clad aluminium backed 2). LTI-04503,MP-06503,ML-11006 3). Ceramic dielectric material, conductivity: 1.3W/m-k, 2.2W/m-k, 4). 1.6mm thick, single sided, 35μm (1 oz) 5). Black solder mask/no ident 6). CNC rout outli
Parts & Supplies | Circuit Board Assembly Products
1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm，6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish
Parts & Supplies | Circuit Board Assembly Products
1) Single Sided PCB 2) Material: XPC (94HB), FR-1 (94V0) 3) Thickness: 1.0mm, 1.2mm, 1.6mm 4) Copper weight: 0.5 oz, 1 oz 5) UV solder mask 6) Profile: Punch/ rout 7) Surface finish: OSP, Electro Gold
Parts & Supplies | Circuit Board Assembly Products
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
Parts & Supplies | Circuit Board Assembly Products
1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA
