Electronics Forum | Thu Sep 30 15:06:05 EDT 1999 | Dave F
| Guys & Gals, | | I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc; | | I started with a simple form.....too simple, but now I th
Electronics Forum | Sat May 06 08:46:46 EDT 2000 | Dave F
Sal: Now you�re talkin�, buddy!!! Darrell is correct. All things being equal, thermal relieved vias (and through holes) should be the hottest spot on the board at reflow temperatures. Vias are gonna take on solder like drippin�s take to biscuits.
Electronics Forum | Fri Mar 17 14:53:08 EST 2006 | Board House
Hi Brad, Being that I work for a board house here is my take on this issue. In the past it used to be 1 scrap per palt up to 10% of the total order. scrap is supposed to be sepperated to location and packaged sepertaly. Then it turned into No Scra
Electronics Forum | Thu Oct 26 10:29:03 EDT 2006 | Mike
First, Voiding under thermal pad is unavoidable(pardon the pun), unless you can find a way to add sufficient amount of solder paste to cover the area, and match that solder volume on your terminal leads. I build HVM qty's of "QFN" components w/ therm
Electronics Forum | Wed Apr 08 05:41:37 EDT 1998 | Alan Pestell
We currently use the Loctite system of Glue/stencils and are getting very good results. You may still have a height problem is you solder resist is too thick. The UK sales person is Bob.goss@loctite-europe.com & he may give you more help. The only ot
Electronics Forum | Thu Aug 10 12:14:12 EDT 2000 | Charles
It looks like a giant dpak device but with 5 leads. The problem is that on approx 3% of our boards one more pins are open circuit. It appears that the pins are not in contact with the pads. Board is HASL finish IR oven Paste Koki 953i. If you have a
Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F
Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in
Electronics Forum | Tue Apr 07 15:55:37 EDT 1998 | Michael Allen
| I'm also in the "Don't score it" camp. Routed breakaways are much better. If your wave solder process has decent control on the wave height, you shouldn't worry about flooding the boards. | The fine pitch consideration for panelizing - Since you
Electronics Forum | Wed Jul 12 09:45:16 EDT 2000 | Charlie
The following are questions my boss has ask me to send out to you folks. This is done in an effort to see "What does the rest of the world do?" [if such a world could possibly exists, in the first place]. If you would select any or all questions to r
Electronics Forum | Tue May 18 15:36:18 EDT 1999 | Tony
| | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil,
