Industry News | 2012-09-28 07:02:31.0
KIC today announced that the new ProBot will begin shipping effective October 2012.
Events Calendar | Wed Jun 21 00:00:00 EDT 2017 - Sat Jun 24 00:00:00 EDT 2017 | Bangkok, Thailand
Assembly Technology Expo
New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m. 4 zone convection 300 mm sold
New Equipment | Test Equipment
The AKM600P is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for wafers or panels up to 600 mm x 600 mm. With time-temperature profiling capa
New Equipment | Rework & Repair Equipment
Rapid, Safe Soldering or Desoldering on High Mass, Heat-Sinking Assemblies Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's and
Industry News | 2017-10-16 19:30:03.0
IBL Technologies, LLC will exhibit in Hall A4, Booth 216 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. The IBL team will highlight the VAC745 vapor phase soldering machine and BLC420 reflow vapor phase soldering system.
Industry News | 2022-01-29 13:18:22.0
Altus has added to its vapor phase soldering product line-up with the introduction of the new 2100 vapor phase inline soldering system from ASSCON.
Industry News | 2013-03-18 10:28:43.0
SEHO Systems GmbH,will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
