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New Equipment | Solder Paste Stencils
Step-up / Step-down Stencil. The patented step stencil from LaserJob, called PatchWork® - stencil, was developed to print in one printing step different paste deposit heights. Due to the multiplicity of different component leads on one printed circu
Industry News | 2013-01-12 12:44:55.0
Aculon announces the launch of their latest generation of stencil coating technology. Aculon’s proprietary technology treats the underside of stencils to make them fluxophobic i.e. repels flux and oils.
Industry News | 2013-08-14 09:16:16.0
FCT Assembly announces that Field Application Engineer Tony Lentz will present at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 10, 2013 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2014-08-28 11:51:49.0
Viscom announced today that its Business Development Manager, Jacques L’Heureux, will present the paper titled “Highly Accurate 3D Solder Paste Inspection Comparing Nano Coated Stencils with Non-Coated Results” at the upcoming SMTA International exhibition.
Industry News | 2018-11-16 15:44:41.0
Specialized Coating Services announces that it was awarded a 2018 Mexico Technology Award for its Conformal Coating Services. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2014-06-12 11:13:16.0
FCT Assembly announces the promotion of Rodney Wade to Regional Sales Manager.
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
Industry News | 2013-10-31 14:45:50.0
FCT Assembly today announced that it will both exhibit and present during the upcoming SMTA LA/Orange County Expo & Tech Forum, scheduled to take place Tuesday, November 5, 2013 at The Grand Event Center in Long Beach, CA. Tony Lentz will present “Can Nano Coatings Really Improve Stencil Performance?”
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