Industry News | 2023-11-20 14:30:54.0
StenTech® Inc. is pleased to announce that it received a 2023 GLOBAL Technology Award in the category of Stencils for its groundbreaking Advanced Nano Coating. The award ceremony took place during productronica, the world's leading trade fair for electronics development and production in Munich, Germany.
Industry News | 2014-08-28 11:13:11.0
FCT Assembly today announced that Field Application Engineer Tony Lentz will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition.
Industry News | 2023-08-29 07:23:24.0
StenTech® Inc. is excited to announce its participation at SMTA Chihuahua, taking place on Thursday, Sept. 7, 2023 at the Sheraton Chihuahua Soberano. The company will exhibit its highly acclaimed Advanced Nano Coating and showcase its complete product line of various stencils and tooling.
Industry News | 2008-11-12 20:09:45.0
November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.
Industry News | 2023-07-31 19:24:11.0
StenTech® Inc. is excited to announce its participation in the SMTA Michigan and SMTA Ohio Expos. The company will exhibit its highly acclaimed Advanced Nano Coating and showcase its complete product line of various stencils and tooling. The expos are scheduled for Tuesday, Aug. 15, 2023, at Laurel Manor in Livonia, MI, and Thursday, Aug. 17th, 2023 at the Embassy Suites by Hilton Cleveland-Rockside in Independence, Ohio.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
Technical Library | 2023-05-22 17:46:29.0
Over the past several years, much research has been performed and published on the benefits of stencil nano-coatings and solvent under wipes. The process improvements are evident and well-documented in terms of higher print and end-of-line yields, in improved print volume repeatability, in extended under wipe intervals, and in photographs of the stencil's PCB-seating surface under both white and UV light. But quantifying the benefits using automated Solder Paste Inspection (SPI) methods has been elusive at best. SPI results using these process enhancements typically reveal slightly lower paste transfer efficiencies and less variation in print volumes to indicate crisper print definition. However, the improvements in volume data do not fully account for the overall improvements noted elsewhere in both research and in production.
Industry News | 2013-11-20 16:41:51.0
FCT Assembly today announced that Field Application Engineer Tony Lentz will present at the upcoming SMTA Austin (CTEA) Expo & Tech Forum, scheduled to take place Thursday, December 5, 2013 at the Norris Conference Center in Austin, TX. Lentz will present “Can Nano Coatings Really Improve Stencil Performance?”
Industry News | 2023-10-31 19:19:30.0
StenTech® Inc. today announced that it received an esteemed 2023 Mexico Technology Award in the category of Screen/Stencil Printing Consumables. The award celebrates StenTech's revolutionary Advanced Nano Coating, a groundbreaking technology that sets a new benchmark for stencil performance and precision. The award was announced at a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
