SIPLACE D2 � Speed Placement Machine With its two gantries, the SIPLACE D2 is the solution for high speed and high flexibility production. With the SIPLACE head modularity, stay flexible with the choice of two 12 and/or 6-nozzle C&P heads.
SIPLACE D4 � High-Speed Placement Machine The four-gantry SIPLACE D4 is equipped with four fast 12-nozzle Collect & Place heads that have been improved for higher robustness and reliability. The machine can place up to 66,000 components per hour w
SIPLACE D3 � Multi Functional Placement Machine The SIPLACE D3 with its three gantries can place up to 30,100 components per hour and can be equipped with a SIPLACE TwinHead. That makes the SIPLACE D3 a fast and flexible all-rounder that can even pl
Measurement and Control Digital Input/Output PCI Express bus PCI/LPCI bus IISA bus Compact PCI USB Serial &GPIB Communication PCI Express bus PCI/LPCI bus IISA bus Compact PCI USB Bus expansion System IISA bus expansion Bus expans
Technical Library | 2009-10-22 02:38:13.0
An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical applications. Conformal coatings have long been used to protect electronic assemblies from their operating environment but can vary hugely in their protective performance. It is the objective of this article to explain in detail why it is important to qualify coating products to the relevant standards and how different coating types affect performance.
Technical Library | 2010-02-10 23:50:23.0
The electronics industry has recently undertaken the transition to lead-free processing as a direct consequence of the RoHS directive, which came into force in July 2006. However, this is unlikely to be the last transition required since the European Solvent Emissions Directive, 1999 is starting to be implemented and enforced by national governments. This is resulting in pressure on larger manufacturers, currently emitting more than 5 tonnes of solvent vapour per annum to take steps to limit and reduce their emissions.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
Industry News | 2015-10-11 18:04:26.0
Indium Corporation announces the release of its newest technology publication, SMT with Phil Zarrow, authored by SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting.
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The Worlds Largest Distributor of New, Refurbished, and Second Hand Electronic Test and Measurement (T&M) Equipment.
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SMT machines supplier used machines in very good conditions. Screenprinter SPI AOI Chipmounter (Panasonic, Yamaha, etc...) Reflow Oven Solder wave Conveyors N2 Generator etc..
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