New Equipment | Industrial Automation
GE FANUC P70360-SDN new and Original USA 1 year warranty EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 Amikon supplys automation spare parts and control systems (DCS, PLC, panel con
New Equipment | Industrial Automation
GE FANUC 64WKS-M240/50-RLG new and Original USA 1 year warranty EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 Amikon supplys automation spare parts and control systems (DCS, PLC, pa
Industry News | 2014-04-22 14:31:18.0
MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
| https://www.wesource.com/test-and-measurement-equipment/hp-spectrum-analyzer-display-8566a-id-700837-10/22/
! Newsletter Email Address: Click here to unsubscribe HP Spectrum Analyzer + Display 8566A ID_700837 (10/22) Home > Test and Measurement Equipment Click to enlarge More images HP Spectrum Analyzer
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_pic_place_philips.html
(5 bar like 7CFM) On a skid ready to ship Good Condition - Start up and Run Location: Phoenix, Arizona Price: $20,000 USD Philips Comet II Pick and Place Machine Package See more photos below Previous Page Home SMT & PCB Equipment
