Industry Directory | Manufacturer
Wisman High Voltage Power Supply Co.,Ltd, is the professional X-ray generator, DC high voltage power supply, PCB mount module and X-ray source manufacturers.
【Type】 XRA 【Power(W)】 5W、10W、20W、30W、50W 【maximum output voltage(kV)】 ,5,,6,7,10,20,25,30, Typical application: The ROHS tester Thickness gauge Capacitor charging, Nuclear instrumentation, Nondestructive detection, Portable X ray machine,
The filament preheating type X ray tube high-voltage power supply, patent product Typical application: X ray fluorescence spectrometer, aluminum strip thickness, aluminum plate thickness, paper, film, foil thickness measurement, elemental analysis,
Electronics Forum | Wed Sep 01 03:48:26 EDT 1999 | Brian
| Is there any Legistration and(or) Regulation for Lead Free | | electronic product in Europe, U.S.A. and Japan? | | If you have any summarized data about that, Let me know. | | There is no legislation, as far as I know, in either the USA or Eur
Electronics Forum | Wed Sep 01 07:51:38 EDT 1999 | Earl Moon
| | Is there any Legistration and(or) Regulation for Lead Free | | | | electronic product in Europe, U.S.A. and Japan? | | | | If you have any summarized data about that, Let me know. | | | | | There is no legislation, as far as I know, in eithe
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Industry News | 2021-11-30 01:54:12.0
After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
