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IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

SMTA International Harsh Environments Symposium Keynote Speaker Announced

Industry News | 2016-08-17 19:47:43.0

SMTA announced the keynote speaker for the 2016 Harsh Environments Symposium, part of the SMTA International technical conference September 25 - 29, 2016 in Rosemont, Illinois.

Surface Mount Technology Association (SMTA)

ESD Control for Electronics Assembly

Training Courses | ONLINE | | ESD Control Training Courses

Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Keynote Announced

Industry News | 2012-01-10 19:07:22.0

SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for IWLPC 2012 in San Jose, CA. John Ellis will detail the very possible threat of Cyber-Physical Terrorism in his presentation, "A Trojan Chip in Your Smartphone? It's Coming..."

Surface Mount Technology Association (SMTA)

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

MicroReplay

Industry Directory | Manufacturer

Repair of Apple equipment, especially liquid damaged, physically, damaged, and otherwise failed products.

IC package reliability test

Industry News | 2019-05-14 02:14:06.0

Test is for your progress!

Symor Instrument Equipment Co.,Ltd

How to inspect the temperature recovering time of thermal shock chamber?

Technical Library | 2019-11-12 02:09:22.0

Thermal shock test chamber can be used for testing the chemical change or physical damage on composite materials caused by the thermal expansion and contraction of the sample in the shortest time,which is subjected to extremely and continuous high and low temperature environment.so how to check the temperature recovery time of this chamber? Normally we take following steps to inspect the temepratuire recovering time: 1.Install the temperature sensor at the specified position, and adjust the temperature controller of hot zone and cold zone to the required nominal temperature respectively. 2.The temperature increases and reduces respectively,30min after temperature in two zones reach stable status,record temperature value of the measuring point,pls set the temperature value of two zones to be required nominal temperature. 3.The temperature shock test chamber automatically places the inspected load into theh ot zone,select the corresponding retention time according to regulated standard. 4.Set the transfer time,then the inspection load is transferred from hot zone to cold zone, and the temperature of the measuring point is observed and recorded, and then the reverse conversion of the load from cold zone to hot zone is carried out according to the same method, and the temperature of the measuring point is observed and recorded. www.climatechambers.com

Symor Instrument Equipment Co.,Ltd

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

New Equipment | Materials

500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo

Integral Technology, Inc

Temperature cycle machine for IC package reliability test

Industry News | 2019-05-08 00:26:12.0

Temperature cycling machine,we also call it thermal shock chamber,it's widely applied in semiconductor manufacturing industry.

Symor Instrument Equipment Co.,Ltd


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