Electronics Forum | Thu Oct 28 08:26:40 EDT 2004 | curious
What are the defects you see when the stencil is over 50 n/cm? I can't recall ever seeing a (stencil caused) defect that wasn't a dent, ding or some other physical damage, and I would have a very hard time sending back a stencil that is working fine,
Electronics Forum | Thu Feb 03 12:21:15 EST 2005 | Chunks
Lets get to the simple things. Wave or Reflow? Wave soldered parts have a higher susceptibility to physical damage until they are waved. That�s were I normally see this type of break. Usually, the crack is a circular pattern in the cap if it�s fr
Electronics Forum | Fri Oct 28 14:09:39 EDT 2022 | ttheis
Allowing a part to go over the board boundaries can cause collisions when boards are nested. The software on these machines has limitations but it is plenty capable and rooted in preventing physical damage to the machine. Once you are familiar with t
Electronics Forum | Mon Sep 11 14:15:28 EDT 2000 | Gary
I am looking for some details about the failure modes in popcorned components. Does the component usually fail to operate. Is the damage likely to extend to the gold bond, wires, or substrate. We have experienced a high failure rate on a subset of
Electronics Forum | Thu Aug 19 10:50:51 EDT 1999 | John Thorup
| I have a few general ESD tote questions: | | 1) For purposes of transporting within a factory, are tops necessary to the tote containers? | | 2) Are there any other colors beside black that are conductive? | | Thanks, | Mike Demos. Sort of depen
Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef
IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Tue Nov 25 18:39:59 EST 2014 | rhcriad
We have an MPM UP2000 stencil printer and have a lot of issues with burned out 6410 driver cards (or driver cards just failing to work). I have looked over these threads and found that this is a common issue with these cards. I understand that thes
Electronics Forum | Tue Jan 27 02:00:40 EST 2009 | sachu_70
Your image does not clearly explain the problem. However, I can see a good heel fillet formation at the joint. In general, TSOP leads are delicate and should handled with immense caution and good ESD protection. First let us be clear that any "rework
Electronics Forum | Tue Sep 16 20:41:41 EDT 2008 | davef
Q1. Can anyone tell me if there is a procedure for storing raw PCB's? A1. Yes, there are thousands of procedures for storing raw PCB. Why so many? Everyone writes their own procedure. Generally, they say: * Boards require individual separation and p
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