The Next Generation of SMART Pick & Place Machines from Samsung have arrived. Boasting increased placement rates with the SM482 achieving an optimal speed of 28'000cph compared to the previous SM421 model of 21'000cph. With a built in vacuum pump t
The Finesse� offers a throughput rate of 12,500 CPH with a vast feeder capacity of 198 x 8mm tapes plus Internal Matrix Tray positions in a remarkably compact footprint. This machine incorporates all of the sophistications which are common throughout
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Used SMT Equipment | Pick and Place/Feeders
Make: SumsangModel: Decan S1 Details:1.Maximum PCB Handling Size: Standard size is 510x510mm, optional size is 1500x460mm, capable of handling PCBs up to 1500mm(L) x 460mm(W). 2.Mounting Speed: Up to 47,000 CPH (under optimal conditions). 3.Mounting
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung SM482 Plus: Main Features of SAMSUNG SMT Pick and Place Machine 1. Realizes a Super-high Speed Placement Speed of 75,000 CPH Realizes the Highest Placement Speed Among Chip Shooters of the Same Class by Adopting a New Flying Head Mechanis
NOVA LINHA DE INSERSORAS SM (PICK&PLACE) DE ALTO VOLUME DA SAMSUNG. INOVADORA, VELOZ E FACIL OPERAÇÃO, SUPERA AS CONCORRENTES EM QUALIDADE, PRODUTIVIDADE E PREÇO. ENTRE EM CONTATO CONOSCO: KTI TECNOLOGIA INDUSTRIAL LTDA FN: 11-4585-0662 SITE: WWW.KT
Industry Directory | Consultant / Service Provider / Manufacturer
We do Component Level Repair training on Laptops, including BGA work, and hand soldering all SMD components.Included in our packages is the ability to fault find and diagnose problems in circuits.
Used SMT Equipment | Pick and Place/Feeders
Quad Pick & Place Model: QSX-1 Serial Number: 3376 Quad QSX-1 Pick and Place System Features: Dual gantry design provides placement rates up to 7,000 cph takt time Handles board sizes from 3.2" x 3" to 19.3" x 25" In-process QuadAlign touch
