Full Site - : pin and to and pad (Page 15 of 15)

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach

| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys

| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen

DDR3 - BGA VDD and VDDQ Pins - Design Guidelines

Electronics Forum | Mon Apr 09 06:55:54 EDT 2018 | tsvetan

are there unplugged vias on the BGA pads?

Re: Wave Soldering 14 and 16 Pin SOICs

Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega

| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce

I mounted the parts on the buck-boost DCDC converter and measured the characteristics

Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe

I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching

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