Full Site - : pin and to and pad (Page 5 of 15)

Nordson DAGE to Exhibit Bond Test and X-Ray Solutions at SEMICON West 2012

Industry News | 2012-06-11 12:36:11.0

Nordson DAGE, announces it will exhibit in Booth #5971 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Nordson DAGE

Pickering Interfaces to Feature PXI and LXI Switching Solutions and Signal Routing Software at SEMICON West

Industry News | 2017-07-06 10:06:36.0

Pickering Interfaces will showcase their latest high-density PXI and Ethernet LXI Switching Solutions along with their Signal Routing Software at SEMICON West, booth 5162, on July 11-13, 2017 in San Francisco, CA. Below is a sampling of the products that will be highlighted at the show:

Pickering Interfaces Ltd.

Practical Components Adds Amkor's FusionQuad� Test and Thermal Cycle Boards to Its Lineup

Industry News | 2008-12-15 15:28:33.0

LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.

Practical Components, Inc.

FCT Assembly to Display Advanced Solder Pastes and Stencil Technology at SMTAI 2009

Industry News | 2009-09-17 15:08:48.0

GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

FCT ASSEMBLY, INC.

Essemtec Announces Ability to Dispense Material and Place LEDs on Film Substrates

Industry News | 2008-05-18 01:34:26.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it can perform material dispensing and consecutive placement of LEDs on film substrates.

ESSEMTEC AG

JTAG Technologies - 25 Years of Innovation and Dedication to Boundary Scan

Industry News | 2018-10-27 16:12:01.0

This year (2018) JTAG Technologies are proud to celebrate their 25th year of developing, supplying and supporting world-class board (PCBA) test and programming solutions based on IEEE Std 1149.x .

JTAG Technologies B. V.

Indium Corporation to Host PCB and Component Defects Webinar

Industry News | 2020-08-22 04:07:55.0

Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).

Indium Corporation

What is SMT and where to by SMT spare parts

Industry News | 2017-08-17 06:55:03.0

what is SMT and where to by SMT spare parts

SMTPLAZA CO.,LTD

Thermaltronics’ Tips to Improve Soldering Tip Life and Reduce Cost

Industry News | 2018-10-09 18:31:30.0

Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

Thermaltronics USA, Inc.

Pin-in-Paste Reflow Calculations and Special Cases

Industry News | 2018-10-18 08:43:30.0

Pin-in-Paste Reflow Calculations and Special Cases

Flason Electronic Co.,limited


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