Full Site - : pin to pad defects (Page 13 of 32)

Indium Corporation’s Indium8.9HF Solder Paste Technology Solution to Avoid the Void™

Industry News | 2016-02-11 13:36:43.0

Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

Indium Corporation

SEHO to Highlight New AOI Function at the 16th Annual SMTA Atlanta Expo & Tech Forum

Industry News | 2012-04-10 15:42:07.0

SEHO Systems GmbH will showcase the new AOI function for its best-selling selective soldering system - the SEHO PowerSelective

SEHO Systems GmbH

New Nordson YESTECH Investment Takes MC Assembly’s Quality Inspection Capabilities to the Next Dimension

Industry News | 2017-03-29 07:39:45.0

Electronics Manufacturing Services Provider Invests in Upgraded 3D Inspection of Printed Circuit Board Assemblies.

Nordson YESTECH

Everett Charles Technologies to Feature Lead-Free POGO� Contacts at APEX 2008

Industry News | 2008-03-13 20:19:57.0

Pomona, CA - March 2008 -The Contacts Product Group (CPG) of Everett Charles Technologies (ECT) and atg Test Systems announces that it will exhibit LFRE, its Lead-Free POGO Contacts, in booth 1383 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008, in Las Vegas.

Everett Charles Technologies

ECT to Debut New HyperCore Base Material at SEMICON West 2012

Industry News | 2012-06-11 18:32:49.0

Everett Charles Technologies’ (ECT) announces that it will highlight the new HyperCore in Booth #6557 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Everett Charles Technologies

AIM Solder to Exhibit NC259 Solder Paste at SMT Hybrid Packaging 2013

Industry News | 2013-03-18 17:06:13.0

AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

AIM Solder

ICON Technologies to Showcase Icon i8 Screen Printer at Productronica 2007

Industry News | 2007-11-04 19:44:20.0

ICON Technologies, a leading screen printing company, announces that it will display the Icon i8 Fully Automatic Screen Printer at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

ICON Technologies

ICON Technologies to Showcase Icon i8 Screen Printer at NEPCON China 2008

Industry News | 2008-04-07 21:05:31.0

ICON Technologies, a leading screen printing company, announces that it will display the Icon i8 Fully Automatic Screen Printer with distributor WKK in booth 1D15 at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

ICON Technologies

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Industry News | 2013-04-01 09:02:49.0

AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA

AIM Solder

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

Industry News | 2013-04-08 19:29:43.0

AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

AIM Solder


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