Industry News | 2007-11-01 02:12:55.0
MINNEAPOLIS - October 31, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will feature SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth A4.262 with GPS Technologies at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2008-03-14 19:37:03.0
MINNEAPOLIS - March 2008 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2215 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2008-04-07 21:53:22.0
MINNEAPOLIS - December 20, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in the West Hall L1, booth 1A26 - at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.
Industry News | 2008-04-08 23:15:05.0
MINNEAPOLIS - April 2008 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in distributor AssemRus booth number 13 Hall 104 at the upcoming ExpoElectronica exhibition and conference, scheduled to take place April 15-18, 2008 at the Crocus Expo, Moscow.
Industry News | 2009-12-07 19:38:22.0
POWAY, CA — October 2009 — Production Solutions Inc., a leading engineering, design and manufacturing company, announces that it will feature the RED-E-SET high-density system in Europe-SMT’s booth in Hall A3, Stand 270 at the upcoming Productronica exhibition, scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2015-04-03 16:03:48.0
New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve test quality and yield of ICs for mobile applications.
Industry News | 2008-10-01 12:28:44.0
Agilent's R&D scientists for In-Circuit Test solutions will be presenting at various sessions throughout the conference.
Industry News | 2010-03-24 12:57:09.0
GREELEY, CO — FCT Assembly to highlight its range of new solder pastes in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2009-09-17 15:08:48.0
GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
