Industry Directory | Consultant / Service Provider / Manufacturer
PFC Flexible Circuits Limited designs, manufactures, and assembles flexible circuits; single-sided, double-sided, multilayer and rigid flex. We are ISO 9001 and 13485 approved.
Industry Directory | Manufacturer
Hitech Circuits Co., Limited is a PCB manufacturer from China and we focus on multilayer printed circuit board; High density PCB /HDI, hard gold board; Flexible board / FPCB; Bergquist Aluminum based
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
Electronics Forum | Mon Apr 11 06:54:03 EDT 2011 | mosborne1
Wipe off your linear scales and clean your quadalign lense.
Electronics Forum | Mon Apr 11 15:57:25 EDT 2011 | bobpan
If the feeders that you are having problems with have tall parts in them.....and these are the ones the machine is stopping on.....check to see that you are not scanning higher than what your function 30 nozzle height is. In other words...if your fun
Used SMT Equipment | Adhesive Dispensers
YAMAHA placement machine YV100X type substrate size: 1, M-Type: L460 * W335 ~ L50xW50mm / t = 0.4 ~ 3.0mm 2, L-Type: L460 * W440 ~ L50xW50mm / t = 0.4 ~ 3.0mm 3, ※ATS20A use: L460*W250～L50xW50mm Second, YAMAHA placement machine YV100X productio
Used SMT Equipment | General Purpose Equipment
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2003-07-08 09:22:20.0
A new range of coding profiles for Combicon wire-to-board connectors aims to avoid the pitfalls of inserting the wrong plug into a header when making plug-in connections to a PCB.
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Parts & Supplies | Pick and Place/Feeders
SM8MM feeder pitch screw J70652273A J7066061B Other Samsung parts are available: J7066336A REEL BRAKE SPG J70660338C REEL BRAKE SPG PIN J70660021C REEL POST J6006300850 FLAT HEAD CAP SCREW J9065186A CLAMP SWITCH CABLE ASS'Y J3405002A MICRO SWI
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Parts & Supplies | Pick and Place/Feeders
JUKI placement machine 44MM pitch adjustment fixing block E6133706000 Model: JUKI placement machine Specification: 44MM feeder pitch adjustment fixed block Part No.: E6133706000 Name: 44MM Feeder spacing adjustment fixed block E6128706000 JUKI
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-06-12 10:33:58.0
The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
J7065948A LOCATION FLANGE J7066159A LIMIT SHAFT J7066155A STOP PAWL SPRING PIN J7066158A Y ECCENTRIC PIN
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Career Center | Chino, California USA | Technical Support
The role of the Field Service/applications engineer is to provide professional service and support for Scienscope customers by performing field service installation, startup, repairs and maintenance of x-ray equipment. Typical duties will include b
Career Center | Grand Rapids, Michigan USA | Engineering
MAIN DUTIES: Performs new process development, monitors and maintains the processes in all areas of manufacturing including, but not limited to assembly, soldering, conformal coating, prep and related equipment. Responsible for generating, i
Career Center | Madurai, India | Engineering,Production
I have 1.6 years of experience in SMT as team leader I have manage 40 member in our company we production team leaders must check the loading materials first then the quality team will check.. And I have a knowledge in Quality too..
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Messages-Reference-Guide-22100026.pdf
FLOware Info and Error Messages Reference Guide Messages Reference Guide Version 1.1 November 28, 2016 Part No. 22100026 for FLOware
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_error-in-jlead-stepmodels_topic2403.xml
0.50 mm Height SOJ package. The average Height is 3.55 - 3.79 mmThere is no such thing as a 0.50 mm Pitch SOJ. SOJ is a 1.27 mm pitch part Your package may be a SOL package and you picked the wrong component familyYou did not post a URL link to the component datasheet, so there is little we can do to help you Error in J-Lead Step-Models
