Electronics Forum | Tue Jun 03 10:28:09 EDT 2014 | swag
Incoming inspection: Look for flaws and measure position of v-score as well as depth. If v-scored on both sides of panel, make sure v-scores are in alignment. Follow the PCB thru all processes inspecting after each stage of processing, especially
Electronics Forum | Wed Feb 14 16:38:00 EST 2018 | cbart
i have seen that happen when the wrong process was utilized! your boards looked like they were v-scored and someone broke them apart, proper method would be to use a scoring separation machine.. pizza cutter. this would prevent this. its not a good i
Electronics Forum | Wed Nov 13 02:28:27 EST 2019 | trino
Hello, I am a Japanese engineer. I am sorry for my unskillful English. Have you ever encountered cracks in chip resistors or IC components due to board mechanical stress? Especially, I'm looking for a case in the PCBs Depaneling process(pizza cutte
Electronics Forum | Fri Feb 21 11:49:25 EST 2020 | SMTA-Tom
Tabs are generally faster to cut through vs a v-scored board. Cutting the V-scored boards with a saw is an option but it is not faster...it just decreases the potential damage that can happen when using a pizza cutter. Preferred method would be to us
Electronics Forum | Wed Aug 01 11:03:20 EDT 2001 | Chip Gill
I read your request for design information on panel layout for V-scoring, and felt the need to respond. Scored PWB's are indeed more efficient to produce and depanel than tab routed PWB's, but there are also drawbacks associated with this method. T
Electronics Forum | Mon Nov 08 11:01:12 EST 1999 | Brian Larson
We are leaving 12-18 thousands material when scoring. Several components are cracking during depanelization. The pizza cutter machines out there are either too expensive or too slow to solve our problem. I am looking for a magical solution. In case
Electronics Forum | Mon Nov 08 19:10:10 EST 1999 | Brian W.
Oh boy, does that bring back memories!!!!! You are most likely breaking components when the board is flexed during separation. Any components perpendicular to the score are candidates for mechanical stress. We overcame the problem by making our ow
Electronics Forum | Wed Jul 15 13:33:56 EDT 1998 | Don Welling
I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress diff
Electronics Forum | Tue Feb 28 16:58:39 EST 2006 | PWH
Too fast heating/cooling rate in reflow (look at mfg's spec.). Z "overdrive" on pick and place or chipshooter though unlikely I would say. Depanelization method (bending a scored board to break it is tough on things). Bad PCB design - cap. too clo
Electronics Forum | Thu May 11 17:28:40 EDT 2006 | bradlanger
Steve, We have had the same problem at my company and unfortunately I do not have any good news for you. We are using a pizza slicer type depanalizer from FKN and if the MLCC caps are layed out too close to the edge they still break. We had to add th
