Industry News | 2008-04-07 19:18:42.0
Essemtec announces it will introduce the Semiautomatic SMT Prototyping System, EXPERT in distributor -------- booth ------ at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
Industry News | 2011-03-28 12:11:28.0
The new SIPLACE SX placement platform and innovative setup concepts with random feeder positioning place technology leader ASM Assembly Systems GmbH & Co. KG (formerly Siemens Electronics Assembly Systems) at the center of this year's APEX trade show in Las Vegas.
Industry News | 2009-04-23 20:46:52.0
FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.
Industry News | 2008-09-30 22:07:25.0
Essemtec, the leading Swiss manufacturer of highly flexible production systems for electronics, announces that it has opened a new customer training center in Suzhou, China. Automatic and semiautomatic SMD production equipment is installed for demos, education and evaluation.
Technical Library | 2023-05-02 19:16:57.0
1.5 with a 150μm specification window. For 0201 components, the minimum requirement is CpK > 2.0 with a 100μm specification window. The spec window may need to be reduced down to 75μm if the controls for high volume manufacturing are insufficient. Also directly impacting the placement quality is the ability to apply sufficient solder consistently to the board. The goal is to maintain current printing practices, but the effect of powder size will be examined. This paper will evaluate the impact of placement accuracy and solder powder size on 0201 manufacturing quality.
Industry News | 2008-10-07 21:01:46.0
ESSEMTEC, the leading manufacturer in Mexico of surface mount technology production equipment for mid volumes, announces that it will showcase several SMT production systems at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
Industry News | 2007-10-08 23:25:30.0
ESSEMTEC, a leading manufacturer of surface mount technology production equipment, announces that it will showcase several SMT production systems in distributor Torenko & Associates� booth at the upcoming Mexitr�nica exhibition, scheduled to take place October 23-25, 2007, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
Used SMT Equipment | Pick and Place/Feeders
Tact time: 0.20sec/chip with line array camera Simultaneous pick with 8 heads 0.45 sec/SO with line array camera Simultaneous pick with 4 heads 1.4 sec/QFP with line array camera Sequential pick with 4 heads 3.7 sec/QFP with area CCD camera In fin
