Panasonic NPM-W2 SMT Pick and Place Machine ❙ Introduce of Panasonic SMT Pick and Place Machine Explore the Panasonic SMT Pick and Place Machine, known for its high-quality performance in component assembly. Improve production efficiency and accu
Panasonic Modular SMT Placement - Flexible and Efficient Component Assembly ❙ Introduce of Panasonic SMT Placement Panasonic NPM-D3 electronics assembly chip shooter, Panasonic SMT placement, Panasonic PCB pick and place machine, with 16
Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
Electronics Forum | Wed Jun 12 20:04:03 EDT 2002 | scottxiao
Thank you very much!
Used SMT Equipment | Soldering - Reflow
The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Industry News | 2003-02-19 09:34:32.0
Joined Forces to Continue Support of the Interconnect Market
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2001-05-23 16:29:52.0
Management consultant R. Michael Donovan outlines the problems and opportunities of performance measurement as an "enabling force" for improving overall business performance...
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Events Calendar | Fri Jun 07 00:00:00 EDT 2019 - Fri Jun 07 00:00:00 EDT 2019 | San Jose, California USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Events Calendar | Mon Jun 03 00:00:00 EDT 2019 - Mon Jun 03 00:00:00 EDT 2019 | Boston, Massachusetts USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Career Center | Littleton, Colorado USA | Engineering
If you have experience in Satellite Communications or RF Payload Engineering we have advancement opportunities that may be of interest to you. Available positions are in disciplines such as: Shaped Reflector design and analysis Antenna compo
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