Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian
Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to
Electronics Forum | Tue Oct 05 04:23:38 EDT 1999 | Brian
| | | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | | Many tahnks | |
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood
We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu
Electronics Forum | Sat Oct 02 03:51:28 EDT 1999 | Brian
| | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | Many tahnks | | | Don't kno
Electronics Forum | Mon Oct 04 04:37:57 EDT 1999 | Gian.D
| | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | Many tahnks | | | | |
Electronics Forum | Fri Oct 13 17:21:05 EDT 2000 | Jason Nipper
A few weeks back we experienced a wave process problem where we received deposits on our pcb. At first we though it was dedrites but after an outside analysis of the deposits they were found to be tin. We have tried to remove the deposits with brus
Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef
When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control
