Full Site - : plasma remove parylene (Page 9 of 11)

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881

PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro

Wire bonding on gold fingers

Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman

I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood

We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu

Re: adhesive for ptfe boards

Electronics Forum | Sat Oct 02 03:51:28 EDT 1999 | Brian

| | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | Many tahnks | | | Don't kno

Re: adhesive for ptfe boards

Electronics Forum | Mon Oct 04 04:37:57 EDT 1999 | Gian.D

| | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | Many tahnks | | | | |

Tin-oxide deposits

Electronics Forum | Fri Oct 13 17:21:05 EDT 2000 | Jason Nipper

A few weeks back we experienced a wave process problem where we received deposits on our pcb. At first we though it was dedrites but after an outside analysis of the deposits they were found to be tin. We have tried to remove the deposits with brus

Etchback

Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef

When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control

Warming up solder paste at start of days production

Electronics Forum | Thu Jul 22 21:26:29 EDT 2004 | Grant

Hi, It's removed from the fridge, and the tube is loaded into the stencil printer, however it's winter here right now, so it's still quite cold. It's Australia, so when I say cold, that's relative, however the room can be about 10 dec C in the morni

Re: adhesive for ptfe boards

Electronics Forum | Wed Oct 06 08:49:36 EDT 1999 | Dave F

| | | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | | Many tahnks | |

Re: Tin-oxide deposits

Electronics Forum | Wed Oct 18 10:02:04 EDT 2000 | Jason Nipper

I know it's a tin residue because we have a Cheme in house who had a spectrum analysis performed in an outside lab. The waves parameters were out of control long enough to effect a number of units that are, we�ll can I say substaincial in a fiscal s


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