Industry Directory | Distributor / Manufacturer
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
Industry Directory | Consultant / Service Provider
InsulFab is the leader in PCB Tooling with 2 locations and unmatched engineering support we will provide the custom solution
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Electronics Forum | Wed Apr 26 19:10:43 EDT 2023 | cyber_wolf
This machines support table looks similar to AP and UP machines. I believe MPM published the dimensions of the "H" tower that the dedicated plates bolts to. As far as the plate, they are typically (2) pieces with the inside hollowed out to allow for
Electronics Forum | Fri Mar 16 17:15:51 EDT 2007 | davef
Ask the board fabricator to: * Fill the vias with resin. * Then metalize and copper plate the filled via along with the pad. * Then plate with solderability protection. This results in what appears to be a solid pad. For more, look here: http://www
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Used SMT Equipment | Screen Printers
DEK Horizon 03iX SMT Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type Hawkeye 750 or Hawkeye 1700 (optional) 198040 198043 hawkeye Board foil clamp siz
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2003-04-08 14:01:01.0
Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.
Parts & Supplies | Pick and Place/Feeders
we have feeder storage cart in stock. Features and Benefits 2 Feeder shelves with anodized aluminum plates to locate and secure feeder to cart. Tooling designed per manufacturer’s specifications. Feeder Shelves are 35.5” long, positioned per fe
Parts & Supplies | Pick and Place/Feeders
Any interesting, feel free to contact via mail: yzfs1968@aliyun.com, Mobile: +86-13501595476 My200 H3/H4 Tool pipe L-052-0102 L-052-0078 H3/H4 HZ ENCODER SPAREPART L-052-0074 H3/H4 LINEAR GUIDE SPAREPART L-052-0071 H3/H4 SOLENOID PACK SPAR
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2020-07-15 18:29:34.0
In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
Career Center | , | Engineering,Research and Development,Technical Support
INTRODUCTION Ref: TR/EMP/EXP/VOL.IV/05 Mobil Consulting/Recruiting Services; Pursuant to the service contract with the NIGERIAN MOBIL OIL COMPANY (NMOC) FIELD DEVELOPMENT PROJECT in Nigeria, has been mandated to recruit senior services expatriat
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-guidance-request-from-tim-c_topic538.xml
PCB Libraries Forum : VIA Guidance Request From Tim C. PCB Libraries Forum : VIA Guidance Request From Tim C. This is an XML content feed of
| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements/
Plated Through Hole Fill: Understanding the Process and Assembly Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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