Full Site - : plating tin (Page 7 of 66)

Immersion gold VS Plating gold

Videos

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious tr

Headpcb

FCI's 0.5mm Pitch FPC Connector Increases Cable Retention

FCI's 0.5mm Pitch FPC Connector Increases Cable Retention

New Equipment |  

Incorporating a cable lock option, the 62674 series of 0.5mm pitch vertical connectors from FCI provides a high cable retention force for flexible printed circuits. Preheld by the connector's compact slider mechanism, cables are easily mated in a ze

FCI

MS-ENG-KIT21 Two-piece EMI Shields Engineering Kit

MS-ENG-KIT21 Two-piece EMI Shields Engineering Kit

New Equipment | Components

Two-piece Drawn RF Shields Engineering Kit, EMI Shielded Cans, RF Shielding Cabinets for PCB, Board Level Shielding, Tin Plated Steel, SMD. Seamless Protective EMI/RFI Cages, available for purchasing online! Complimentary CAD files are available for

Masach Tech

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy15™ - 85%Sn - 15%Zn – has a wider plastic range of 390°F - 500°F (199°C - 260°C). This makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. KappAloy™ Tin-Zinc solder is designe

Kapp Alloy & Wire, Inc

Effects of Tin Whisker Formation on Nanocrystalline Copper

Technical Library | 2023-02-13 19:23:18.0

Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.

Johns Hopkins Applied Physics Laboratory

HDI PCB

HDI PCB

New Equipment | Assembly Services

TW-HDI PCB 0245 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Year o

TW Technology Limited

RS series vacuum reflow oven RS220

Videos

At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec

Beijing Technology Company

Auspi Enterprises Co., Ltd

Industry Directory | Manufacturer

Auspi Enterprises Co., Ltd., one of the professional suppliers of printed circuits in China. We found your company info on the web knowing that you're dealing with electronics, which we think you may have demand on pcbs.

Multilayer PCB

Multilayer PCB

New Equipment | Assembly Services

TW-Multilayer PCB 0123 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y

TW Technology Limited

Aluminum PCB

Aluminum PCB

New Equipment | Assembly Services

TW-Aluminum PCB 0201 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y

TW Technology Limited


plating tin searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

World's Best Reflow Oven Customizable for Unique Applications
Software for SMT

High Throughput Reflow Oven
PCB Handling Machine with CE

High Precision Fluid Dispensers