Industry News | 2003-02-28 08:22:47.0
Dr. Zhang will lead the global R&D and product formulation activities of the company's tin, tin alloy and lead-free technologies.
Industry News | 2019-12-11 06:21:54.0
Superpower lasers are characterized by small size, light weight, high electro-optic conversion efficiency, stable performance, high reliability and long life. At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating.
Industry News | 2010-01-22 21:15:39.0
January 2010 ? Christopher Associates, a pioneering supplier and distributor to the photovoltaic industry, introduces the Tonsan 1521 Silicone Potting Compound to its product line.
New Equipment | Fabrication Services
8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication Product Name: Multilayer PCB Board Material: FR4 Copper thickness 1 oz all layers Board Thickness: 1.6mm Special requirement Impendence Control Fab by Circuit Boar
Industry News | 2012-04-13 19:02:54.0
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry Directory | Manufacturer
Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
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