Electronics Forum | Mon Jun 14 06:15:18 EDT 1999 | wayne sanita
| We have been using Alpha Tetra/DEK Vector for the last 3 years. Prior to that we were using mesh on frame. | We do about 15 job changes a day and our main runners are loaded about 4 times per week. In the three years we have been using the system
Electronics Forum | Mon Jun 14 15:05:10 EDT 1999 | John Thorup
| | We have been using Alpha Tetra/DEK Vector for the last 3 years. Prior to that we were using mesh on frame. | | We do about 15 job changes a day and our main runners are loaded about 4 times per week. In the three years we have been using the sys
Electronics Forum | Tue Jun 15 18:02:53 EDT 1999 | MMurphy
| | We have been using Alpha Tetra/DEK Vector for the last 3 years. Prior to that we were using mesh on frame. | | We do about 15 job changes a day and our main runners are loaded about 4 times per week. In the three years we have been using the sys
Electronics Forum | Thu Jun 18 22:25:24 EDT 1998 | Dave F
| | | | | We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Wed Jul 14 09:26:55 EDT 1999 | Dave F
| | I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stick.
Electronics Forum | Wed Jul 14 19:09:54 EDT 1999 | JohnW
| | | I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stic
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
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