New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
New Equipment | Assembly Services
Do you need rapid PCB prototyping with quick turnaround times? For the past 11 years, engineers, assemblers, and designers from around the world have counted on us for their quick turn PCBs. Companies big and small know that they can depend on us f
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Industry News | 2008-07-24 17:38:17.0
Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
The new LiquiPrep material preparation and feeding unit https://www.scheugenpflug-dispensing.com/en/news/press-releases/article/the-new-liquiprep-material-preparation-and-feeding-unit-415.html Scheugenpflug has launched a new generation of its prov
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-User-Guide-22100079K.pdf
User Interface: Computer Computer Computer drives and ports are available behind the door of the front panel. All computer controls are inaccessible to the operator. USB Port When a USB (universal serial bus) device is plugged into the USB port, the
