PHD, Inc. designs and manufacturers a complete line of pneumatic and hydraulic actuators for industrial automation. Standard products include cylinders, powered slides, rotary and multi-motion actuators, grippers, escapements, clamps, and sensors.
Industry Directory | Manufacturer
Surface Mount Techniques has been supplying quality printing equipment to the surface mount printed circuit manufacturing industry since 1984.
Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
FKN Systek K6000 - Fully automated singulation of up to 10 panels. Singulate Panels with up to 10 Scorelines. Process PCBs with Components up to 2.5" High. Integrated Input and Output Conveyors. Output Conveyor with Loaded Board Detector. Quic
Electronics Forum | Thu Mar 28 09:43:19 EDT 2019 | dekhead
Pneumatic power down error does go back to MMX12. MM's info is communicated to NM (in PC enclosure) via 100 way cable. Depending on software version, the "Pneumatic Power Down" error may be the default (initial) error generated with bad connection /
Electronics Forum | Thu Mar 28 08:12:19 EDT 2019 | carehawk
We had an issue where a vision cable got cut and a few wires were exposed and possibly shorted. We fixed the cable and since then have had numerous errors with the last one being pneumatic power down. We have air to the machine and have checked the p
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | SPI / Solder Paste Inspection
Sw level: 2.7.9 Configured with: (4) side view cameras (2) top down cameras , 1 each: Standard camera Power: 120 Vac Condition: Complete and Operational, available for inspection prior to shipment. Availability: Immediate Location/Shipping:
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Model NO. : GW-UL250L , GW- UL330L ,GW- UL390L ,GW- UL460L PCB size(L×W)~(L×W) :(50×50)~(350×250),(50×50)~(455×330),(50×50)~(530×390),(50×50)~(530×460), Machine size (L×W×H) : 1370×750×1200 , 15
Parts & Supplies | Screen Printers
DEK solvent box Pneumatic Fittings Part Number : 107265 MORE DEK PARTS IN STOCKS DEK STEPPER MOTOR 140452-181245 DEK SPRING SHAFT KIT 145884 DEK SPRING G0332 DEK SOLVENT PUMP ASSY 191088 DEK SOLVENT 183668 DEK SOLENOID VALVE 165431 DEK SI
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2017-04-20 13:51:14.0
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html The automatic PCB magazine loader is used at the starting of the SMT production line for loading of PCBA to the line.he unit loads the production line automatically by pu
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Portsmouth, New Hampshire USA | Production
Assembly: * Must be mechanically or electrically inclined * Perform a wide variety of assembly / erecting operations and procedures, i.e. bearing fits, drilling / tapping, hydraulic / lube/pneumatic. * Must be able to read blueprints or schematics
Career Center | West Melbourne, Florida Andorra | Engineering
SMT Equipment Maintenance Specialist Develop and maintain SMT process equipment through preventative maintenance and procedures for both new and existing production equipment to ensure quality, repeatability, delivery and efficiency goals are achiev
Career Center | , | Maintenance
Specialized in Siemens equipment, and OmniExcel 7, MPM Ap25, Momentum.
KingFei SMT Tech | https://www.smtspare-parts.com/sale-40254077-ev2500-108-c11e2-ckd-dc12v-pneumatic-control-valve.html
: 50pcs Contact Now Chat Now Detailed Product Description Brand: CKD Model: EV2500-108-C11E2 Part Name: Pneumatic Control Valve Power
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