Industry News | 2012-02-03 13:29:38.0
Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #538 at the upcoming IPC APEX Expo.
Industry News | 2021-06-01 17:41:59.0
Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.
Industry News | 2021-08-09 10:50:02.0
Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.
Industry News | 2021-10-04 12:10:40.0
Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Printed Circuit Boards FR4 1.6mm 94V0 Solar Panel Rigid PCB Quik Details: Product Name: Solar Panel Rigid PCB Base Material: FR4 Epoxy Resin Bare Board Size: 120mm x155mm Surface Finishing: Leaded HASL PCB Material Flamming rate: 94
New Equipment | Fabrication Services
8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication Product Name: Multilayer PCB Board Material: FR4 Copper thickness 1 oz all layers Board Thickness: 1.6mm Special requirement Impendence Control Fab by Circuit Boar
Industry News | 2021-11-12 04:12:57.0
The perfect solder joint requires the perfect connection between the components because compromises lead to poor results, defects in the components and expensive rework. Weller's solder wire (WSW) platform provides only the best and exceeds expectations.
Industry News | 2012-06-25 13:08:17.0
SEHO North America, Inc. and Balver Zinn announce a Selective Soldering Seminar from the SEHO Academy, scheduled to take place Tuesday, September 25, 2012.
