Industry News | 2014-08-26 16:19:51.0
Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2015-12-01 11:46:19.0
SolderStar joined industry experts from the electronics manufacturing sector to address the issues surrounding thermal profiling for today’s highly complex assemblies and discuss the way this impacts the manner in which the industry measures component temperatures accurately.
Industry News | 2022-01-03 07:24:21.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2013-04-08 13:46:37.0
Kyzen Corporation announces that Debbie Carboni will present “Removal of Flux Residues from Highly Dense Assemblies” at IMAPS NE 40th Symposium & Expo on Tuesday, May 7, 2013 at the Holiday Inn Conference Center in Boxborough, MA.
Industry News | 2015-05-11 17:16:30.0
KYZEN is pleased to announce that Debbie Carboni will present at the IMAPS METRO Chapter Full Day Symposium and Vendor Night, scheduled to take place Wednesday, May 13, 2015 at the Clarion (former Holiday Inn) in Ronkonkoma, New York. Carboni will present the paper entitled, “Advanced Packaging Cleaning Fluid Best Practice.”
Industry News | 2021-02-12 16:08:40.0
Nihon Superior Co. Ltd is pleased to announce thatit will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloyalong with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2022-11-28 07:00:51.0
With the development of the precision and stability of SMT equipment, the manufacturing process and testing links have gradually become the key to the development of the industry. At the same time, the fierce competition in the consumer electronics market has put forward higher requirements for the quality of electronic components. In the production process, it is necessary to use various testing technologies to inspect defects and faults in time and repair them, among these testing technologies, X-ray inspection is one of the most critical process to improve the SMT BGA QFN soldering quality.
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