Industry News | 2010-09-29 02:16:12.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its Fine-Pitch SMT Kit is now available in both lead-free and tin-lead versions. The lead-free component option is available with the ENIG board finish.
New Equipment | Fabrication Services
High frequency RF, Microwave Printed Circuit Board Design, FAB PNC can provide you with your High Frequency RF PCB and Microwave PCB needs. Our advanced Technologies have made us a leader in the RF/Microwave PCB industry processing FR4 and Rogers Ma
Technical Library | 2015-11-25 14:15:12.0
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.
Layers: 1-20L Material Types: FR-4, High TG, Halogen Free Max.Panel Dimension: 530mm*622mm Outline Tolerance: ±0.10mm Board Thickness: 0.40mm-3.20mm Board thickness Tolerance(t=0.8mm):±10% Width: 0.10mm Spacing: 0.10mm External: 35um-140um Int
Industry News | 2011-05-19 21:51:24.0
Christopher Associates introduces Onstatic Technology Corp.’s (OTC) R-500 WH White LPI Solder Mask, designed specifically for LED lighting applications.
Technical Library | 2018-03-07 22:41:05.0
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.
Industry News | 2017-01-21 08:16:49.0
Welcome to this Bob Willis “Defect of the Month” video This month we cover Poor Hole Fill on PCBs during Soldering https://www.youtube.com/watch?v=BlSF9ubGEA8
New Equipment | Test Equipment
The Agilent Technologies Infiniium 80000B Series and InfiniiMax II probing system will lead to improved measurements and increased design margins. The signal integrity advantages of the Agilent Infiniium 80000B Series Scopes and InfiniiMax Probing Sy
Industry News | 2015-04-10 15:53:44.0
Blue Thunder Technologies will offer LOCTITE GC 10, named "The Game Changer"
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
