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360 Brass CDA is a free cutting brass made from the combination of copper and zinc. 360 Brass CDA has a poor cold working capacity and fair hot working capacity. 360 Brass CDA is a suitable for being joined by soldering, brazing, Oxyacetylene Welding
Siemens Siplace X4 Pick And Place Machine Siemens Siplace Pick And Place Machine Siemens Pick And Place Machine Siemens Pick and Place Machine Patch speed:120000CPH Dimension:1900×2734 Weight: 3460kg Product description: Siemens Siplac
Industry News | 2014-08-26 16:19:51.0
Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2012-08-20 13:12:53.0
SEHO North America, Inc. and Balver Zinn announce a Selective Soldering Seminar from the SEHO Academy, scheduled to take place Tuesday, September 25, 2012
Industry News | 2012-08-20 13:13:54.0
SEHO North America, Inc. and Balver Zinn announce a Selective Soldering Seminar from the SEHO Academy, scheduled to take place Tuesday, September 25, 2012
Technical Library | 2023-05-07 19:26:34.0
Misprint Circuit Assemblies ■ Cleaning misprints is a production gap ■ Commonly cleaned in stencil cleaning equipment ■ Stencil Cleaning equipment allows for the + Collection and filtration of wet solder paste ■ Stencil Cleaning equipment short comings + Inability to clean B-Side misprints + Poor rinse quality 3
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
http://www.flason-smt.com/product/Samsung-nozzle-of-TN-series-CN-sereis.html Samsung nozzle of TN series & CN sereis SMT Nozzle Samsung Nozzle Samsung nozzle of TN series & CN sereis Usage:Samsung pick and place machine Product descriptio
http://www.flason-smt.com/product/Samsung-nozzle-of-TN-series-CN-sereis.html Samsung nozzle of TN series & CN sereis SMT Nozzle Samsung Nozzle Samsung nozzle of TN series & CN sereis Usage:Samsung pick and place machine Product descri
Industry News | 2017-11-15 20:34:16.0
SEHO Systems GmbH is pleased to announce that it was awarded a 2017 Global Technology Award in the category of Soldering – Selective for its Integrated Additional Processes in Selective Soldering Systems. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. The SEHO PowerSelective and SEHO SelectLine selective soldering systems can be equipped with an automated selective brush system and an AOI system for immediate automatic cleaning and inspection of solder joints directly after the soldering process. All processes are integrated in ONE machine.
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