Electronics Forum | Fri Sep 22 04:43:18 EDT 2006 | greg york
Interesting you should ask this what problems are you seeing. Non wetting and blow holes and shallow fillets at all??? Cheers Greg
Electronics Forum | Wed Nov 21 05:57:30 EST 2018 | premkumar_haribabu
Hi Robl, Thanks for your qucik reply!! , i understand if we use aggresive flux that we can impove solder wetting over nickel plate vs PCB pads & we need to solder through 12 zones reflow oven. Prem
Electronics Forum | Tue Feb 03 12:39:20 EST 2004 | paul_bmc
We had the data at the time and it was quite high. More false calls then anything. I do not have the data anymore it since has been archived. When the system was introduced we had 1 engineer and 2 operators trained for programming and running the
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
Electronics Forum | Mon Dec 13 05:43:27 EST 1999 | Wolfgang Busko
Hi Steve, 20 mil pitch shouldn�t be that problem nowadays. In your case bridging and poor wetting seem to go hand in hand. For the poor wetting try to eliminate it by using different paste (higher activated) and work on your profile. Coplanarity also
Electronics Forum | Wed Jul 09 11:58:03 EDT 2003 | sam
When we try another test by using less solder paste, we found under the microscope that the solder was actually stick on the LED gold surface, but not having good wetting. By this finding, we can basically conclude that it was poor solderability caus
Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef
We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo
Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F
Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c
Electronics Forum | Fri Sep 22 09:45:26 EDT 2006 | bradlanger
Greg, All the above. It looked like it was going to be a drop for SNPB HASL at first but after a few thousand boards we started running into all the problems you are describing. We first started seeing non wetting on SMT pads. The solder would wet t
Electronics Forum | Thu Aug 28 11:13:53 EDT 2008 | janz
Have you tried to run the same process but with diffrent solder paste manufacturer.? This give you information whether paste is ok. Try also print paste on the bare board and run through reflow oven. Check 2-3 boards. Is it the same places where i
