Industry News | 2021-08-09 10:50:02.0
Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.
Industry News | 2021-10-04 12:10:40.0
Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.
Industry News | 2021-02-25 13:23:32.0
Indium Corporation will feature its uniquely formulated flux-cored wire during the virtual IPC APEX Expo, to be held March 8-12.
Industry News | 2021-11-12 04:12:57.0
The perfect solder joint requires the perfect connection between the components because compromises lead to poor results, defects in the components and expensive rework. Weller's solder wire (WSW) platform provides only the best and exceeds expectations.
Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
Industry News | 2008-08-07 15:26:07.0
Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2008-01-23 10:31:04.0
GREELEY, CO � January 21, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd, announce plans to exhibit SN100C� Lead-Free products in booth 128 at the upcoming Electronics West exhibition, scheduled to take place January 29-31, 2008 in Anaheim, Calif.
Industry News | 2008-01-31 00:10:18.0
GREELEY, CO � January 29, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., announce that it will exhibit SN100C� Lead-Free products paste in booth 213 at the upcoming IPC International Conference on Flexible Circuits, scheduled to take place February 12-14, 2008 in Phoenix, Ariz.
