Parts & Supplies | Chipshooters / Chip Mounters
Panasonic CM402/212/602/101/NPM-D3/W2/TT Feeder for sale. 8mm - 12/16mm 24/32mm 44/56mm 72/88mm POP Feeder used or new all can offer. Welcome to contact ,
New Equipment | Education/Training
We have created interactive CD ROM, inspection posters and photo library CD ROMs covering design, assembly, soldering, rework and inspection
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
Parts & Supplies | SMT Equipment
Panasonic CM402/602 NPM Original feeder for sale. 8mm 12/16mm 24/32mm 44/56mm 72mm pop feeder Welcome to contact me if wanted.
New Equipment | Solder Materials
For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others.
Technical Library | 2021-12-16 01:33:11.0
Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.
Parts & Supplies | Pick and Place/Feeders
We have full range of SMT pick and place machine feeder and Nozzle: 1.Nozzle and feeder for Fuji, Juki, Yamaha, Samsung, Siemens, Panasonic CM602, CM402... electric feeder and vibration feeder have a large stock., 2.feeder parts, cutter, filter,
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Parts & Supplies | Pick and Place/Feeders
Part Name: POP Feeder Use for : CM402 , CM602 , DT401 , NPM Part code : N610095856AB N610095857AB N610056362AA Conditions: Brand new Lead time: 1day other stocks: N610117446AF N610117446AE N610117446AC KXFW1KS5A00 KXFW1KSBA00 N610031080A
Industry Directory | Distributor
Above Board Electronics - Distributor for your Global Requirements
