Industry Directory | Manufacturer
Design,prototype and production of electronic components for industry as well as consumer and POP.
Industry Directory | Distributor
Above Board Electronics - Distributor for your Global Requirements
New Equipment | Board Handling - Storage
The basic unit for these PCB racks holds 32 boards up to 6.7" (170mm) long. Modules can be assembled side by side to hold longer Printed Circuit Cards. Standard extrusions allow card width of 0 to 10.25". For wider cards, extrusions can be cut to cus
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
Electronics Forum | Mon Jul 07 10:31:27 EDT 2008 | realchunks
Yeah, I burned my Pop-Tarts* this morning. Someone turned the knob on the cafeteria toaster oven. Gotta check them knobs no matter where ya go. (* = Poster has no affiliation with Pop-Tarts or Pop-Tarts products)
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Used SMT Equipment | Pick and Place/Feeders
Product number: KE - 3020VA/ VRA Detailed product introduction Constantly improve the KE series products. So as to realize the high speed highquality electric production line of flexible structure. Chip components 20900 CPH chip (laser identific
Used SMT Equipment | SMT Equipment
Product name: KE - 3020 va/VRA general placement machine at a high speed Product number: KE - 3020 va/VRA Detailed product introduction Constantly improve the KE series products. So as to realize the high speed high quality electric production
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Parts & Supplies | Pick and Place/Feeders
KXF0E0T9A01 BELT N610039716AB GEAR 180GC181150 BANDO SYNCHRONOUS 430L 7.5MM NPM N510061363AA Belt N510050718AA Belt N510021326AA CM602 Belt N210047118AB GEAR POP FEEDER N610095856AA CM402 CM602 Feeder Guide N210103441AA NM-FJW-2A In
Parts & Supplies | Pick and Place/Feeders
N610095856AB Panasonic POP feeder for CM402 , CM602 , NPM ,DT401 We provide CM602/CM402/NPM Feede, 4mm- 108mm , original new and used both in stock , delivery fast. Also we can provide the other spare parts of Panasonic machines , such
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
The NexJet® 8 System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. Read more at http://www.nordsonasymtek.com/nexjet
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Clearwater, Florida USA | Maintenance,Production,Quality Control,Technical Support
I have approximately 14 years experience in the Electronics manufacturing industry. I have experience from manual assembly to machine technical support for SMT eqiupment. I also have some experience with AI equipment. I have Automatic Optical Inspect
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
SMTnet Express, December 13, 2018, Subscribers: 31,514, Companies: 10,659, Users: 25,503 Assembly Reliability of TSOP/DFN PoP Stack Package Credits: Jet Propulsion Laboratory Numerous 3D stack packaging technologies have been implemented
| https://unisoft-cim.com/bom-dni-importing.html
. The Unisoft software interprets DO NOT INSTALL / NO POPS (DNI) components in 2 ways. They either can be listed in the BOM or not listed in the BOM
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries?page=2
. Electronics - Semiconductor Overview of dispense, plasma treatment, x-ray inspection, bond testing and related equipment for advanced semiconductor packaging - flip chips, 3D packages, PoPs, SiPs, more
