Industry News | 2014-08-18 10:23:40.0
The IPC Solder Products Value Council (SPVC), in cooperation with iNEMI, has written a white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that helps users determine which alloy characteristics best match their requirements.
New Equipment | Cable & Wire Harness Equipment
Low Cost Table Top Crimp Machine. The C 200 is a table top low cost crimp tool which takes a variety of dies from different manufacturers. Air operated using standard factory air (5 bar min), with a pressing capacity of up to 1,200 kp, this portable
Industry News | 2019-04-23 12:05:35.0
Speed up your wire crimp process with the right tools. Quick and Convenient Wire Crimping with this portable bench top unit . A custom 2 position die made to specifications speeds up the production process for this double barrel connector housing. The housing with 2 barrel contacts is placed into the tooling nest, and one AWG 4 wire is placed into each contact. Stepping on the pneumatic foot pedal crimps both wires and contacts at the same time.
Industry News | 2010-03-03 14:33:02.0
Minneapolis, MN - The SMTA is pleased to announce the program for the 2010 International Conference on Soldering and Reliability being held May 17-20 in Toronto, Ontario, Canada
Industry News | 2007-09-24 17:54:39.0
With less than two weeks until SMTA International (Orlando, Florida, October 7 -11) the SMTA is pleased to report that the goals for a meaningful and unique event are becoming a reality. Designed for our industry, by our industry, SMTAI is the one exhibition that allows you to focus exclusively on your major programs and projects.
Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2013-04-25 16:41:53.0
IPC Electronic System Technologies Conference (IPC ESTC), Tuesday, May 21, 2013, in Las Vegas.
Industry News | 2015-10-11 15:49:37.0
Each year, IPC APEX EXPO® features industry’s most dynamic and innovative minds to deliver keynote presentations that are forward thinking, inspirational and entertaining. IPC APEX EXPO 2016 will feature Dean Kamen, inventor, entrepreneur and tireless advocate for science and technology, as the opening keynote presenter on Tuesday, March 15, 2016. Kamen will present, “Inventions and Innovations.”
Industry News | 2001-11-27 13:09:48.0
IPC has announced its tutorial and workshop schedule for IPC Printed Circuits Expo 2002. A total of 34 courses are scheduled, including 15 full-day tutorials on March 24-25, and 19 half-day workshops, which will take place on March 25 and 28.