Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Industry News | 2012-12-12 20:41:40.0
The Partnership was formed to provide awareness and training in the techniques and practices required to detect and avoid counterfeit components and the costs, legal issues and risks associated with them in order to prevent infestation of counterfeit material into the supply chain. There is an increasing volume of counterfeit electronic parts entering the aerospace supply chain and others, posing significant performance, reliability and safety risks.
Industry News | 2009-09-26 16:52:56.0
Minneapolis, MN - The SMTA and CALCE/University of Maryland are pleased to announce that the 3rd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts will be held on December 2-3, 2009 at the University of Maryland. Counterfeit electrical, electronic, and electromechanical (EEE) parts pose a significant threat in the global supply chain. In addition to losses to legitimate producers for the components, equipment failures or malfunctions can present situations that cause mission failures, health and safety concerns and could jeopardize national security.
Industry News | 2010-11-15 22:52:31.0
IPC — Association Connecting Electronics Industries® is criticizing the "bad science" in the latest revision to Greenpeace’s electronics scorecard, "Guide to Greener Electronics." The guide rates consumer electronics companies against Greenpeace criteria on hazardous substances, take back and recycling, and energy use and climate change.
Industry News | 2022-05-18 12:24:25.0
Supply Chain Crisis: When will the Chip Shortage End? What is the solution? Supply Chain issues are prevalent, causing a supply crunch and resulting in cut production, delinquent delivery shortages, and loss of profit. Then there is offshore manufacturing, which poses a security threat as democracy is threatened across the globe. The 2021 National Defense Authorization Act (NDAA) has a call for action to translate American innovation into domestically manufacturable, market-ready technology to provide solutions to the current market threats.
Industry News | 2012-09-11 19:10:13.0
. To help electronics manufacturers and their suppliers make sense of the rule, IPC – Association Connecting Electronics Industries® has developed, “Summary of the Final SEC Rules on Conflict Minerals,” a 7-page document that is downloadable as a PDF file.
Industry News | 2012-10-31 12:57:41.0
IPC and SMTA jointly announce the agenda for Session 8 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2012-10-31 12:58:49.0
IPC and SMTA jointly announce the agenda for Session 8 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2010-07-02 16:00:34.0
In a victory for IPC members and the Canadian electronics industry, the Canadian Department of the Environment, on June 26, 2010, elected not to ban five rosin-containing substances from all products manufactured and sold in Canada.
Industry News | 2012-02-16 17:47:19.0
What will have the greatest impact on the electronics industry in five years? Will it be technology, manufacturing, government regulations or global competition? The Wednesday Keynote at IPC APEX EXPO® 2012, February 28-March 1 at the San Diego Convention Center, will feature five panelists who will provide their unique perspectives on what the game changers will be for the industry.
.png)
