Electronics Forum | Mon Nov 17 19:15:24 EST 2003 | Victor
I currently have an inventory of trim caps that have oxidation on the leads. I performed a dip test and am averaging 90% wetting on the leads. On product that has these components already installed is there any risk leaving the parts that have oxid
Electronics Forum | Tue Dec 23 16:21:14 EST 2003 | davef
Bert It's gotta make you twitchie when the guy poses his cerd as "ISO 9000-2001 registered". Since 2000 was the moost recent time that ISO9000 was reved-up.
Electronics Forum | Tue Jan 18 20:52:43 EST 2005 | fastek
Brad- Try doing a search of the archives. I'm sure you will pull up many discussions to help you out. The question you pose comes up every 2-3 months it seems....perhaps it's beaten to death. Rick
Electronics Forum | Wed Jul 05 11:05:10 EDT 2006 | Rob
Most of the time UK companies seem to pose more of a threat to themselves than that of the offshore manufacturing exodus. Wait 'till he puts his lunch through the oven for an oncore.
Electronics Forum | Fri Aug 18 09:28:24 EDT 2006 | russ
okay, very admirable, so you will need to answer the rest of the questions that were posed. Such as the actual profile, storage and handling, registration of paste, etc.... I would lean towards Chunks thoughts myself as well. Russ
Electronics Forum | Thu May 17 10:47:36 EDT 2007 | floydf
My boss posed me an interesting question: would it save energy to leave the wave solder machine on all night instead of turning it off each night? We run 1 shift, and have timers on our machines. My instinct is that it would be cheaper to turn off th
Electronics Forum | Tue Mar 28 14:23:11 EDT 2023 | smith88
Glass Micro BGA- I consistently have chips or micro cracks from the manufacture and some happen during install, what functionality risk do these pose to the product? They pass test... I cannot find an established criteria for this type of component
Electronics Forum | Wed Mar 14 21:05:59 EST 2001 | davef
Mike makes a very good [ no, make that excellent!!!] point about reflowing solder at the same time you are curing glue. There is some evidence that the outgasing during the cure of glue can affect the LT reliability of solder connections. [Regardles
Electronics Forum | Tue Nov 23 15:55:23 EST 1999 | Larry
Edgar, Check the Archives, there was someone else a while back who posed this type of question. I'm sure Dave F with his wealth of knowledgs will be able to tell you the thread name. Seems to me that the consensus was, that to enter this market you n
Electronics Forum | Mon Sep 14 21:08:14 EDT 1998 | Steve Schwarz
Currently there are 2-3 questions on the admin page that are technical and are not getting the response they deserve. This is probably because the main stream of the SMTnetters don't check this part of the forum as often as they check the technical
