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SAC305 soldering to 58Bi/42Sn

Electronics Forum | Tue Nov 24 11:44:12 EST 2009 | mikesewell

I think you're okay reworking with SAC305 but rework with SnPb will result in a SnPbBi alloy with a lowered melting point that may pose reliability concerns. As far as suitability of 58Bi42Sn goes - depends on your requirements.

Solder void underneath the mosfet

Electronics Forum | Wed Mar 24 10:28:51 EDT 2010 | Sean

Hi all, Anyone used to come across solder void underneath mosfet as shown in the attached file? Will this pose any reliability issue, such as get burnt during functional test? How to over come this problem? As far as I know there is no acceptabl

Effect of copper

Electronics Forum | Wed Jul 05 11:25:10 EDT 2017 | davef

You've posed a very broad question, I'm not sure what you're asking. As a starting point ... Kester reported “The Effect Of Metallic Impurities On The Wetting Properties Of Solder“ [http://www.smtnet.com/library/index.cfm?fuseaction=view_article&art

Component Damage By XRay

Electronics Forum | Mon Jun 18 19:57:40 EDT 2001 | Gil Zweig

Dave: You pose a very good question. We have been in the electronics x-ray inspection business for 18-1/2 years and, to date, we have not received a single report of damage associated with x-ray exposure. However... we do see signs of long term x-ra

2512's To Wave or not to Wave????

Electronics Forum | Tue Apr 27 12:19:17 EDT 1999 | John

Has anybody had experience wavesoldering 1 watt 2512 resistor packages?? I know it can be done, but are there reliability issues? We are in the middle of a new product and the question was posed to me "Can we use 2512 1 watt resistors on the bottom

Solder Paste Printed Volume

Electronics Forum | Mon Dec 03 03:42:15 EST 2001 | ianchan

Hi, actually this point was raised a cuppa times, from the past discussion forums... thats why I posed this questions once again *yawn* to find out any new delvelopments in relation to paste Volume giving accuracy??? Obviously it doesn't seem to h

BGA void removal

Electronics Forum | Sat Oct 19 11:48:39 EDT 2002 | davef

Good points, John. Continuing to track on the voiding issue, why remove voids anyhow? * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on at least on a temporary bas

Moisture Sensitive Devices

Electronics Forum | Thu May 06 10:21:09 EDT 2004 | Rob

Let me pose this scenario and ask your opinion. My manufacturing plant is located in New Orleans. Since summer is close upon us, the humidity in my SMT room where the machines and components reside get around 30-50%RH. I've got this Siemens waffle ch

Reflow issues with leaded paste and mixed components

Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero

Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol

Thermocouple Design

Electronics Forum | Sun Mar 25 15:38:07 EDT 2007 | Gibbon!

Couple of things. Type T thermocouples are solder friendly. However usually a header with screw terminals poses no problem as the temperature differential is nil. Getting thermocouple leads wet causes problems because two dissimilar metals + condu


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